TLMI’s Young Leaders Development Organization will host the 2nd Global Congress for industry management professionals September 11-12, 2014 at Michigan State University immediately following Labelexpo Americas 2014.
The congress program includes:
- networking opportunities
- skills development workshop
- presentations on packaging innovation and sustainability
The 1st Congress was hosted by European sister association FINAT in 2012
in Germany. This time TLMI extends a warm welcome to our members and colleagues abroad.
Throughout more than five decades of dynamic development, the Michigan State University School of Packaging has built significant research expertise and earned national and international recognition. MSU has conferred more than 7,000 academic degrees – and is known worldwide as the leading resource for developing package professionals. It is therefore a fitting location for the congress.
Mark your calendars now. Additional details and registration information will be announced in the coming weeks.
This labelling news was spotted at TLMI - Tag and Label Manufacturers Institute, INC
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